Equipment applications in the semiconductor packaging and testing industry include: Die sorter, translational sorter, automatic film applicator, automatic disc changer, automatic reel vacuum packaging machine, etc.
ALUP is our independent research and development, manufacturing of high performance, high stability, high yield translational loading and unloading equipment. Manually place the JEDEC Tray with IC into the equipment; Also put the BIB board into the device. There are two modes of equipment operation:
1. During equipment operation, the IC will be absorbed from the Tray and placed into the Socket of the BIB board through the loading and absorbing module. After all the sockets in the BIB board are filled with IC. Finally, BIB was removed manually.
2. Draw the COMPLETED IC from the BIB board and place it into the OK or NG Tray according to the test results. Finally, remove the BIB or Tray manually.
Save manpower, avoid human-caused errors and increase output.
1. Machine size：≧2740x1830x1900mm
2. machine weight：1500KG
3. Suction nozzle number：≧X8
4. Supported chip size：7x7 to 20x20(mm)
5. Test board size：≦620mm x 202mm
6 contact force：Max 150kg, -/+ 0.2kg
7. Uph：≦9000 units
8. Visual detection ability：Marking\Lead\Ball inspection
9. Storage quantity：2 input/output tray Track
10. failure rate：<1/3000
11. data acquisition：Jam rate,UPH,Yield
Telephone：0512-66569952
Fax：0512-66569953
Mailbox：david.xu@mtssz.com
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